SUNLIT PRECISION TECHNOLOGY CO., LTD.
https://sunlit-tech.en.taiwantrade.com/
About SUNLIT
SUNLIT has dedicated to high precision and high quality stamping field with near 4 decades of experience in both R&D and manufacturing. Our mission is to provide professional service, reliable quality, and increase competitiveness for our customers.
We have abundant resources of R&D abilities and Manufacture experiences. We can pierce a minimum 0.06 mm width punch hole on the 0.12 mm thickness copper material. Special stamping process abilities can increase the thickness of the raw materials.
Why SUNLIT
Product Collection
Probe Pin (cylindrical crown shape) of IC packaging final test
Product Feature
Cylindrical crown shape Probe Pin of IC packaging final test. Firm construction made by Micro Stamping, and can avoid Kneeling needles and Burning needles. For In-Circuit-Test(ICT) and Functional Test(FCT).
The metal lid of IC Packaging (MEMS)
Product Feature
Metal lid of IC Packaging(MEMS) The precise parts sealed airtight on the IC board to protect the IC chips/dies inside. Made by high precision stamping process, the tolerance of burr height can be less than 0.03 mm. The Minimum size is 1.84 x 1.84 mm.
The 0.06 mm width punch hole on the 0.12 mm thickness copper sheet
Product Feature
The breakthrough technology of high precision stamping process. The width of the punch hole can be HALF of the material thickness. The minimum width can be 0.06 mm now.
Burr-less high precision stamping process
Product Feature
No Burr, No Fracture, and No Rollover(stamping caused pressure round angle) caused during the high precision stamping process. Cutting surface roughness can be within "150 nm".